مؤتمر
Ash-induced modification of porous and dense SiCOH inter-level-dielectric (ILD) materials during damascene plasma processing
| العنوان: | Ash-induced modification of porous and dense SiCOH inter-level-dielectric (ILD) materials during damascene plasma processing |
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| المؤلفون: | Dalton, T.J., Fuller, N., Tweedie, C., Dunn, D., Labelle, C., Gates, S., Colburn, M., Chen, S.T., Lai, T., Dellaguardia, R., Petrarca, K., Dziobkowski, C., Kumar, K., Siddiqui, S. |
| المصدر: | Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Interconnect technology Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International. :154-156 2004 |
| Relation: | Proceedings of the IEEE 2004 International Interconnect Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780383087 9780780383081 |
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| DOI: | 10.1109/IITC.2004.1345724 |