دورية أكاديمية
A reliability study of barrier-metal-clad copper interconnects with self-aligned metallic caps
| العنوان: | A reliability study of barrier-metal-clad copper interconnects with self-aligned metallic caps |
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| المؤلفون: | Saito, T., Ashihara, H., Ishikawa, K., Miyauchi, M., Yamada, Y., Nakano, H. |
| المصدر: | IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 51(12):2129-2135 Dec, 2004 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 00189383 15579646 |
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| DOI: | 10.1109/TED.2004.838512 |