مؤتمر
An optimized face-down bonding process for laser diode packages
| العنوان: | An optimized face-down bonding process for laser diode packages |
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| المؤلفون: | Tew, J.W.R., Wang, Z.F., Shi, X.Q., Li, G.Y. |
| المصدر: | Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Electronics packaging technology Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th. :390-395 2004 |
| Relation: | Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780388216 9780780388215 |
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| DOI: | 10.1109/EPTC.2004.1396640 |