مؤتمر
In-situ electromigration studies on Sn-Ag-Cu solder joint by digital image speckle analysis (DISA)
| العنوان: | In-situ electromigration studies on Sn-Ag-Cu solder joint by digital image speckle analysis (DISA) |
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| المؤلفون: | Luhua Xu, Pang, J.H.L., Xiong, B.S. |
| المصدر: | Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Electronics packaging technology Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th. :410-413 2004 |
| Relation: | Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780388216 9780780388215 |
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| DOI: | 10.1109/EPTC.2004.1396643 |