مؤتمر
Effect of stress on interfacial intermetallic compound development of Sn-Ag-Cu lead-free solder joint on Au/Ni/Cu substrate
| العنوان: | Effect of stress on interfacial intermetallic compound development of Sn-Ag-Cu lead-free solder joint on Au/Ni/Cu substrate |
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| المؤلفون: | Ngoh, S.L., Zhou, W., Pang, H.L., Spowage, A.C., Shi, X.Q. |
| المصدر: | Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Electronics packaging technology Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th. :414-419 2004 |
| Relation: | Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780388216 9780780388215 |
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| DOI: | 10.1109/EPTC.2004.1396644 |