Novel board level drop test simulation using implicit transient analysis with input-G method

التفاصيل البيبلوغرافية
العنوان: Novel board level drop test simulation using implicit transient analysis with input-G method
المؤلفون: Jing-en Luan, Tong Yan Tee
المصدر: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Electronics packaging technology Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th. :671-677 2004
Relation: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:0780388216
9780780388215
DOI:10.1109/EPTC.2004.1396693