مؤتمر
Simulation of warpage considering both thermal and cure induced shrinkage during molding in IC packaging
| العنوان: | Simulation of warpage considering both thermal and cure induced shrinkage during molding in IC packaging |
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| المؤلفون: | Li-Ching Hong, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang |
| المصدر: | 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on. :78-84 2004 |
| Relation: | 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780387449 9780780387447 |
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| DOI: | 10.1109/POLYTR.2004.1402743 |