مؤتمر
Direct plating of Cu on ALD TaN for 45nm node Cu BEOL metallization
| العنوان: | Direct plating of Cu on ALD TaN for 45nm node Cu BEOL metallization |
|---|---|
| المؤلفون: | Shih, C.H., Su, H.W., Lin, C.J., Ko, T., Chen, C.H., Huang, J.J., Chou, S.W., Peng, C.H., Hsieh, C.H., Tsai, M.H., Shue, W., Yu, C.H., Liang, M.S. |
| المصدر: | IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004. Electron devices meeting Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International. :337-340 2004 |
| Relation: | 2004 International Electron Devices Meeting |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780386841 9780780386846 |
|---|---|
| DOI: | 10.1109/IEDM.2004.1419149 |