مؤتمر
Effect of electromigration on mechanical behavior of solder joints
| العنوان: | Effect of electromigration on mechanical behavior of solder joints |
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| المؤلفون: | Ren, F., Nah, J.W., Suh, J.O., Tu, K.N., Xiong, B.S., Xu, L.H., Pang, J.H.L. |
| المصدر: | Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on. :66-69 2005 |
| Relation: | 2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780390865 9780780390867 0780390857 9780780390850 |
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| تدمد: | 15505723 |
| DOI: | 10.1109/ISAPM.2005.1432048 |