مؤتمر
The effect of pretreatment process on electroless nickel bumping for different Al pads
| العنوان: | The effect of pretreatment process on electroless nickel bumping for different Al pads |
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| المؤلفون: | Xiao-Chen Fu, Guo-Wei Xiao, Pui-Chung Law, Ching Ho Chan, P. |
| المصدر: | Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004. Solid-state and integrated circuits technology Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on. 1:603-606 vol.1 2004 |
| Relation: | 2004 7th International Conference on Solid-State and Integrated Circuits Technology Proceedings |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 078038511X 9780780385115 |
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| DOI: | 10.1109/ICSICT.2004.1435078 |