Etch chamber condition-based process control model for shallow trench isolation trench depth control

التفاصيل البيبلوغرافية
العنوان: Etch chamber condition-based process control model for shallow trench isolation trench depth control
المؤلفون: Gaddam, S., Braun, M.W.
المصدر: IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing 2005. Advanced Semiconductor Manufacturing Conference and Workshop, 2005 IEEE/SEMI. :17-20 2005
Relation: IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing 2005.
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:0780389972
9780780389977
تدمد:10788743
23766697
DOI:10.1109/ASMC.2005.1438760