مؤتمر
Drop Impact Reliability Testing for Lead-Free and Leaded Soldered IC Packages
| العنوان: | Drop Impact Reliability Testing for Lead-Free and Leaded Soldered IC Packages |
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| المؤلفون: | Chong, D.Y.R., Kellin Ng, Tan, J.Y.N., Low, P.T.H., Pang, J.H.L., Che, F.X., Xiong, B.S., Xu, L.H. |
| المصدر: | Proceedings Electronic Components and Technology, 2005. ECTC '05. Electronic components and technology Electronic Components and Technology Conference, 2005. Proceedings. 55th. :622-629 2005 |
| Relation: | 2005 Proceedings. 55th Electronic Components and Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780389077 9780780389076 |
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| تدمد: | 05695503 23775726 |
| DOI: | 10.1109/ECTC.2005.1441334 |