مؤتمر
Mechanical behavior of flip chip packages under thermal loading
| العنوان: | Mechanical behavior of flip chip packages under thermal loading |
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| المؤلفون: | Shoulung Chen, Tsai, C.Z., Kao, N., Enboa Wu |
| المصدر: | Proceedings Electronic Components and Technology, 2005. ECTC '05. Electronic components and technology Electronic Components and Technology Conference, 2005. Proceedings. 55th. :1677-1682 Vol. 2 2005 |
| Relation: | 2005 Proceedings. 55th Electronic Components and Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780389077 9780780389076 |
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| تدمد: | 05695503 23775726 |
| DOI: | 10.1109/ECTC.2005.1442017 |