مؤتمر
Challenges in barrier and seed layers characterization of copper technology IC devices
| العنوان: | Challenges in barrier and seed layers characterization of copper technology IC devices |
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| المؤلفون: | Li, K., Er, E., Yeow, T., Tang, D. |
| المصدر: | Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Physical and Failure Analysis of Integrated Circuits Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the. :263-266 2005 |
| Relation: | Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780393015 9780780393011 |
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| تدمد: | 19461542 19461550 |
| DOI: | 10.1109/IPFA.2005.1469175 |