A new observation of the germanium outdiffusion effect on the hot carrier and NBTI reliabilities in sub-100nm technology strained-Si/SiGe CMOS devices

التفاصيل البيبلوغرافية
العنوان: A new observation of the germanium outdiffusion effect on the hot carrier and NBTI reliabilities in sub-100nm technology strained-Si/SiGe CMOS devices
المؤلفون: Chung, S.S., Liu, Y.R., Yeh, C.F., Wu, S.R., Lai, C.S., Chang, T.Y., Ho, J.H., Liu, C.Y., Huang, C.T., Tsai, C.T.
المصدر: Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005. VLSI Technology VLSI Technology, 2005. Digest of Technical Papers. 2005 Symposium on. :86-87 2005
Relation: 2005 Symposium on VLSI Technology
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:4900784001
9784900784000
تدمد:07431562
21589682
DOI:10.1109/.2005.1469222