Structural and thermal investigation for FBAR reliability in wireless applications

التفاصيل البيبلوغرافية
العنوان: Structural and thermal investigation for FBAR reliability in wireless applications
المؤلفون: Fillit, R.-Y., Ivira, B., Boussey, J., Fortunier, R., Ancey, P.
المصدر: 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. Reliability physics Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International. :342-346 2005
Relation: 2005 IEEE International Reliability Physics Symposium. Proceedings 43rd Annual
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:0780388038
9780780388031
تدمد:15417026
19381891
DOI:10.1109/RELPHY.2005.1493109