مؤتمر
Fabrication and wafer-level packaging of Si electrostatic microgripper for micro assembly
| العنوان: | Fabrication and wafer-level packaging of Si electrostatic microgripper for micro assembly |
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| المؤلفون: | Kunnyun Kim, Hyun-Myoung Yoon, Kang Ryeol Lee, Joon-Shik Park, Park, H., Chanwoo Moon, In-Gyu Lee, Joungho Park |
| المصدر: | The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. Solid-State Sensors, Actuators and Microsystems Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on. 1:952-955 Vol. 1 2005 |
| Relation: | TRANSDUCERS '05. The 13th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780389948 9780780389946 |
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| تدمد: | 2159547X 21641641 |
| DOI: | 10.1109/SENSOR.2005.1496612 |