دورية أكاديمية
Distribution of a minor solid constituent in a transfer molded e-pad leadframe package
| العنوان: | Distribution of a minor solid constituent in a transfer molded e-pad leadframe package |
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| المؤلفون: | Yue Huang, Sheng Zhan, Bigio, D., Pecht, M.G. |
| المصدر: | IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 28(3):549-554 Sep, 2005 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 15213331 15579972 |
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| DOI: | 10.1109/TCAPT.2005.848579 |