مؤتمر
Recovery of plasma process induced damage in porous silica low-k films by organosiloxane vapor post annealing
العنوان: | Recovery of plasma process induced damage in porous silica low-k films by organosiloxane vapor post annealing |
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المؤلفون: | Ono, T., Kinoshita, K., Takahashi, H., Fuji, N., Kohmura, K., Sonoda, Y., Yagi, R., Shimoyama, M., Hata, N., Kikkawa, T. |
المصدر: | 2005 International Conference on Integrated Circuit Design and Technology, 2005. ICICDT 2005. Integrated circuit design and technology Integrated Circuit Design and Technology, 2005. ICICDT 2005. 2005 International Conference on. :107-110 2005 |
Relation: | 2005 International Conference on Integrated Circuit Design and Technology |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 0780390814 9780780390812 |
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تدمد: | 23813555 |
DOI: | 10.1109/ICICDT.2005.1502603 |