مؤتمر
Correct modelling of geometry and materials properties in the thermo-mechanical finite-elements-simulation of chip scale packages
| العنوان: | Correct modelling of geometry and materials properties in the thermo-mechanical finite-elements-simulation of chip scale packages |
|---|---|
| المؤلفون: | Zukowski, E., Deier, E., Wiide, J. |
| المصدر: | EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. Thermal mechanical and multi-physics simulation and experiments in micro-electronics and micro-syste Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on. :545-552 2005 |
| Relation: | Thermal Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780390628 9780780390621 |
|---|---|
| DOI: | 10.1109/ESIME.2005.1502865 |