مؤتمر
Correct modelling of geometry and materials properties in the thermo-mechanical finite-elements-simulation of chip scale packages
العنوان: | Correct modelling of geometry and materials properties in the thermo-mechanical finite-elements-simulation of chip scale packages |
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المؤلفون: | Zukowski, E., Deier, E., Wiide, J. |
المصدر: | EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. Thermal mechanical and multi-physics simulation and experiments in micro-electronics and micro-syste Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on. :545-552 2005 |
Relation: | Thermal Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 0780390628 9780780390621 |
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DOI: | 10.1109/ESIME.2005.1502865 |