دورية أكاديمية
A novel joint-in-via flip-chip chip-scale package
| العنوان: | A novel joint-in-via flip-chip chip-scale package |
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| المؤلفون: | Teck Kheng Lee, Zhang, S., Wong, C.C., Tan, A.C. |
| المصدر: | IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 29(1):186-194 Feb, 2006 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 15213323 15579980 |
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| DOI: | 10.1109/TADVP.2005.850506 |