مؤتمر
An overview of packaging and characterization results of pixel multichip modules at Fermilab
| العنوان: | An overview of packaging and characterization results of pixel multichip modules at Fermilab |
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| المؤلفون: | Cardoso, G., Turqueti, M.A., Andresen, J., Appel, J.A., Christian, D.C., Chramowicz, J., Deuerling, G., Hoff, J.R., Kwan, S.W., Mekkaoui, A., Prosser, A.G., Uplegger, L., Yarema, R. |
| المصدر: | IEEE Nuclear Science Symposium Conference Record, 2005 Nuclear Science Symposium Nuclear Science Symposium Conference Record, 2005 IEEE. 2:819-822 2005 |
| Relation: | 2005 IEEE Nuclear Science Symposium Conference Record |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780392213 9780780392212 |
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| تدمد: | 10823654 |
| DOI: | 10.1109/NSSMIC.2005.1596381 |