Integration and optimization of embedded-sige, compressive and tensile stressed liner films, and stress memorization in advanced SOI CMOS technologies

التفاصيل البيبلوغرافية
العنوان:	Integration and optimization of embedded-sige, compressive and tensile stressed liner films, and stress memorization in advanced SOI CMOS technologies
المؤلفون:	Su, L.T., Pellerin, J., Huang, S.F., Khare, M., Schepis, D., Rim, K., Liming, S., Waite, A., Sato, T., Panda, S., Nii, H., Lee, W., Holt, J., Fried, D., Chidambarrao, D., Chen, H., Kepler, N., Raab, M., Greenlaw, D., Stephan, R., Hubler, P., Ruelke, H., Herzog, O., Engelmann, H.-J., Schaller, M., Salz, H., Trui, B., Trentsch, M., Reichel, C., Press, P., Otterbach, R., Neu, A., Lenski, M., Koerner, G., Klais, J., Javorka, P., Hohage, J., Hempel, K., Hellmich, A., Gerhardt, M., Frohberg, K., Feudel, T., Bierstedt, H., Hontschel, J., Kammler, T., Wei, A., Horstmann, M.
المصدر:	IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest. International Electron Devices Meeting 2005 Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International. :233-236 2005
Relation:	International Electron Devices Meeting 2005
قاعدة البيانات:	IEEE Xplore Digital Library