مؤتمر
Precision Micro-Cleaving of 1.55 μm Laser Diode Platelets for Integration with Dielectric Waveguides on Silicon Integrated Circuit Wafers
العنوان: | Precision Micro-Cleaving of 1.55 μm Laser Diode Platelets for Integration with Dielectric Waveguides on Silicon Integrated Circuit Wafers |
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المؤلفون: | Rumpler, J., Barkley, E., Fonstad, C.G., Jr. |
المصدر: | 2006 International Conference on Indium Phosphide and Related Materials Conference Proceedings Indium Phosphide and Related Materials Indium Phosphide and Related Materials Conference Proceedings, 2006 International Conference on. :374-376 2006 |
Relation: | 2006 International Conference on Indium Phosphide and Related Materials Conference Proceedings |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 0780395581 9780780395589 |
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تدمد: | 10928669 |
DOI: | 10.1109/ICIPRM.2006.1634194 |