مؤتمر
Precision Micro-Cleaving of 1.55 μm Laser Diode Platelets for Integration with Dielectric Waveguides on Silicon Integrated Circuit Wafers
| العنوان: | Precision Micro-Cleaving of 1.55 μm Laser Diode Platelets for Integration with Dielectric Waveguides on Silicon Integrated Circuit Wafers |
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| المؤلفون: | Rumpler, J., Barkley, E., Fonstad, C.G., Jr. |
| المصدر: | 2006 International Conference on Indium Phosphide and Related Materials Conference Proceedings Indium Phosphide and Related Materials Indium Phosphide and Related Materials Conference Proceedings, 2006 International Conference on. :374-376 2006 |
| Relation: | 2006 International Conference on Indium Phosphide and Related Materials Conference Proceedings |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780395581 9780780395589 |
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| تدمد: | 10928669 |
| DOI: | 10.1109/ICIPRM.2006.1634194 |