مؤتمر
A study of degradation of ACF joints in chip-on-glass assenblies
العنوان: | A study of degradation of ACF joints in chip-on-glass assenblies |
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المؤلفون: | Lin, Y.C., Chen, X., Wang, Z.P. |
المصدر: | Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. Thermal and Thermomechanical Phenomena in Electronics Systems Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. :826-832 2006 |
Relation: | 2006 Proceedings. 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 0780395247 9780780395244 |
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تدمد: | 10879870 |
DOI: | 10.1109/ITHERM.2006.1645432 |