مؤتمر
Effect of Loading Mode, Temperature and Moisture on Interface Fracture Toughness of Silicon/Underfill/Silicon Sandwiched System
| العنوان: | Effect of Loading Mode, Temperature and Moisture on Interface Fracture Toughness of Silicon/Underfill/Silicon Sandwiched System |
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| المؤلفون: | Song, G.Q., Shi, X.Q., Qin, F., He, C.F. |
| المصدر: | Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. Thermal and Thermomechanical Phenomena in Electronics Systems Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. :1147-1152 2006 |
| Relation: | 2006 Proceedings. 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780395247 9780780395244 |
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| تدمد: | 10879870 |
| DOI: | 10.1109/ITHERM.2006.1645474 |