Interface failure in lead free solder joints

التفاصيل البيبلوغرافية
العنوان: Interface failure in lead free solder joints
المؤلفون: Darveaux, R., Reichman, C., Islam, N.
المصدر: 56th Electronic Components and Technology Conference 2006 Electronic Components & Technology Electronic Components and Technology Conference, 2006. Proceedings. 56th. :12 pp. 2006
Relation: 2006 Proceedings. 56th Electronic Components & Technology Conference
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:1424401526
9781424401529
تدمد:05695503
23775726
DOI:10.1109/ECTC.2006.1645763