دورية أكاديمية
HotSpot: a compact thermal modeling methodology for early-stage VLSI design
| العنوان: | HotSpot: a compact thermal modeling methodology for early-stage VLSI design |
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| المؤلفون: | Wei Huang, Ghosh, S., Velusamy, S., Sankaranarayanan, K., Skadron, K., Stan, M.R. |
| المصدر: | IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 14(5):501-513 May, 2006 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 10638210 15579999 |
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| DOI: | 10.1109/TVLSI.2006.876103 |