دورية أكاديمية
Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications
| العنوان: | Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications |
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| المؤلفون: | Kun-Mo Chu, Jung-Hwan Choi, Jung-Sub Lee, Han Seo Cho, Seong-Ook Park, Hyo-Hoon Park, Duk Young Jeon |
| المصدر: | IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 29(3):409-414 Aug, 2006 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 15213323 15579980 |
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| DOI: | 10.1109/TADVP.2006.875417 |