مؤتمر
3-D topography simulation of via holes using generalized solid modeling
| العنوان: | 3-D topography simulation of via holes using generalized solid modeling |
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| المؤلفون: | Tazawa, S., Leon, F.A., Anderson, G.D., Abe, T., Saito, K., Yoshii, A., Scharfetter, D.L. |
| المصدر: | 1992 International Technical Digest on Electron Devices Meeting Electron Devices Meeting, 1992. IEDM '92. Technical Digest., International. :173-176 1992 |
| Relation: | Proceedings of IEEE International Electron Devices Meeting |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780308174 9780780308176 |
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| تدمد: | 01631918 |
| DOI: | 10.1109/IEDM.1992.307335 |