A test chip design for detecting thin film cracking in integrated circuits

التفاصيل البيبلوغرافية
العنوان: A test chip design for detecting thin film cracking in integrated circuits
المؤلفون: Gee, S.A., Johnson, M.R., Chen, K.L.
المصدر: 1994 Proceedings. 44th Electronic Components and Technology Conference Electronic components and technology Electronic Components and Technology Conference, 1994. Proceedings., 44th. :1050-1057 1994
Relation: 1994 Proceedings. 44th Electronic Components and Technology Conference
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:0780309146
9780780309142
DOI:10.1109/ECTC.1994.367499