Leadframe designs for minimum molding-induced warpage

التفاصيل البيبلوغرافية
العنوان: Leadframe designs for minimum molding-induced warpage
المؤلفون: Nguyen, L.T., Chen, K.L., Lee, P.
المصدر: 1994 Proceedings. 44th Electronic Components and Technology Conference Electronic components and technology Electronic Components and Technology Conference, 1994. Proceedings., 44th. :513-520 1994
Relation: 1994 Proceedings. 44th Electronic Components and Technology Conference
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:0780309146
9780780309142
DOI:10.1109/ECTC.1994.367545