مؤتمر
Leadframe designs for minimum molding-induced warpage
العنوان: | Leadframe designs for minimum molding-induced warpage |
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المؤلفون: | Nguyen, L.T., Chen, K.L., Lee, P. |
المصدر: | 1994 Proceedings. 44th Electronic Components and Technology Conference Electronic components and technology Electronic Components and Technology Conference, 1994. Proceedings., 44th. :513-520 1994 |
Relation: | 1994 Proceedings. 44th Electronic Components and Technology Conference |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 0780309146 9780780309142 |
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DOI: | 10.1109/ECTC.1994.367545 |