Wafer Level Thin Film Encapsulation for MEMS

التفاصيل البيبلوغرافية
العنوان: Wafer Level Thin Film Encapsulation for MEMS
المؤلفون: Gillot, C., Lagoutte, E., Charvet, P.L., Souchon, F., Sillon, N.
المصدر: 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on. :1-4 Jun, 2005
Relation: 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:0780392922
9780780392922
0780392930
9780780392939
DOI:10.1109/HDP.2005.251432