مؤتمر
Wafer Bonding with BCB and SU-8 for MEMS Packaging
| العنوان: | Wafer Bonding with BCB and SU-8 for MEMS Packaging |
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| المؤلفون: | Maik Wiemer, Chenping Jia, Toepper, M., Hauck, K. |
| المصدر: | 2006 1st Electronic Systemintegration Technology Conference Electronics Systemintegration Technology Conference, 2006. 1st. 2:1401-1405 Sep, 2006 |
| Relation: | 2006 1st Electronic Systemintegration Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 1424405521 9781424405527 |
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| DOI: | 10.1109/ESTC.2006.280194 |