مؤتمر
Wafer Bonding with BCB and SU-8 for MEMS Packaging
العنوان: | Wafer Bonding with BCB and SU-8 for MEMS Packaging |
---|---|
المؤلفون: | Maik Wiemer, Chenping Jia, Toepper, M., Hauck, K. |
المصدر: | 2006 1st Electronic Systemintegration Technology Conference Electronics Systemintegration Technology Conference, 2006. 1st. 2:1401-1405 Sep, 2006 |
Relation: | 2006 1st Electronic Systemintegration Technology Conference |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 1424405521 9781424405527 |
---|---|
DOI: | 10.1109/ESTC.2006.280194 |