مؤتمر
Underfill selection for reducing Cu/low-K delamination risk of flip-chip assembly
| العنوان: | Underfill selection for reducing Cu/low-K delamination risk of flip-chip assembly |
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| المؤلفون: | Tong Hong Wang, Yi-Shao Lai, Meng-Jen Wang |
| المصدر: | 2006 8th Electronics Packaging Technology Conference Electronics Packaging Technology Conference, 2006. EPTC '06. 8th. :233-236 Dec, 2006 |
| Relation: | 2006 8th Electronics Packaging Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 1424406641 9781424406647 142440665X 9781424406654 |
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| DOI: | 10.1109/EPTC.2006.342721 |