High Performance 45-nm SOI Technology with Enhanced Strain, Porous Low-k BEOL, and Immersion Lithography

التفاصيل البيبلوغرافية
العنوان: High Performance 45-nm SOI Technology with Enhanced Strain, Porous Low-k BEOL, and Immersion Lithography
المؤلفون: Agnello, P., Ivers, T., Warm, C., Wise, R., Wachnik, R., Schepis, D., Sankaran, S., Norum, J., Luning, S., Li, Y., Khare, M., Grill, A., Edelstein, D., Chen, X., Brown, D., Augur, R., Wu, S., Yu, J., Wong, R.C., Werking, J., Wehella-Gamage, D., Vayshenker, A., Van Meer, H., Van Den Nieuwenhuizen, R., Tian, C., Tabakman, K., Sung, C.Y., Standaert, T., Simon, A., Sim, J., Sheraw, C., Restaino, D., Rausch, W., Pal, R., Prindle, C., Ouyang, X., Ouyang, C., Ontalus, V., Nummy, K., Nielsen, D., Nicholson, L., McKnight, A., Lustig, N., Liu, X., Lee, M.H., Lea, D., Larosa, G., Landers, W., Kim, B., Kelling, M., Jeng, S.-J., Holt, J., Hargrove, M., Grunow, S., Greco, S., Gates, S., Frye, A., Fisher, P., Domenicucci, A., Dimitrakopoulos, C., Costrini, G., Chou, A., Cheng, J., Butt, S., Black, L., Belyansky, M., Ahsan, I., Adam, T., Gabor, A., Wu, C.-H.J., Yang, D., Crouse, M., Robinson, C., Corliss, D., Fonseca, C., Johnson, J., Weybright, M., Waite, A., Nayfeh, H.M., Onishi, K., Narasimha, S.
المصدر: 2006 International Electron Devices Meeting Electron Devices Meeting, 2006. IEDM '06. International. :1-4 Dec, 2006
Relation: 2006 International Electron Devices Meeting
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:142440438X
9781424404384
1424404398
9781424404391
تدمد:01631918
2156017X
DOI:10.1109/IEDM.2006.346879