Direct Silicon Bonded (DSB) Substrate Solid Phase Epitaxy (SPE) Integration Scheme Study for High Performance Bulk CMOS

التفاصيل البيبلوغرافية
العنوان:	Direct Silicon Bonded (DSB) Substrate Solid Phase Epitaxy (SPE) Integration Scheme Study for High Performance Bulk CMOS
المؤلفون:	Yin, Haizhou, Sung, C. Y., Ng, H., Saenger, K.L., Chan, V., Crowder, S., Zhang, R., Li, J., Ott, J. A., Pfeiffer, G., Bendernagel, R., Ko, S.B., Ren, Z., Chen, X., Wang, G., Liu, J., Cheng, K., Mesfin, A., Kelly, R., Ku, V., Luo, Z.J., Rovedo, N., Fogel, K., Sadana, D.K., Khare, M., Shahidi, G.
المصدر:	2006 International Electron Devices Meeting Electron Devices Meeting, 2006. IEDM '06. International. :1-4 Dec, 2006
Relation:	2006 International Electron Devices Meeting
قاعدة البيانات:	IEEE Xplore Digital Library