مؤتمر
Design-for-Reliability Tools for Highlyintegrated System-on-Package Technology
| العنوان: | Design-for-Reliability Tools for Highlyintegrated System-on-Package Technology |
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| المؤلفون: | Pucha, R.V., Hegde, S., Damani, M., Leee, K. J., Tunga, K., Perkins, A., Mahalingam, S., Lo, G., Klein, K., Ahmad, J., Sitaraman, S.K. |
| المصدر: | 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on. :1-1 Apr, 2007 |
| Relation: | 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 142441105X 9781424411054 1424411068 9781424411061 |
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| DOI: | 10.1109/ESIME.2007.360062 |