دورية أكاديمية
A Novel Virtual Metrology Scheme for Predicting CVD Thickness in Semiconductor Manufacturing
| العنوان: | A Novel Virtual Metrology Scheme for Predicting CVD Thickness in Semiconductor Manufacturing |
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| المؤلفون: | Hung, M.-H., Lin, T.-H., Cheng, F.-T., Lin, R.-C. |
| المصدر: | IEEE/ASME Transactions on Mechatronics IEEE/ASME Trans. Mechatron. Mechatronics, IEEE/ASME Transactions on. 12(3):308-316 Jun, 2007 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 10834435 1941014X |
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| DOI: | 10.1109/TMECH.2007.897275 |