مؤتمر
Flip Chip Package-in-Package (fcPiP): A New 3D Packaging Solution for Mobile Platforms
| العنوان: | Flip Chip Package-in-Package (fcPiP): A New 3D Packaging Solution for Mobile Platforms |
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| المؤلفون: | Pendse, Raj, Choi, BS, Kim, Baker, Kim, KM, Kim, YC, Lee, Kenny, Park, Susan, Yang, DW, Zhao, Lily, Gregorich, Tom, Holmes, Pat, Reyes, Ed |
| المصدر: | 2007 Proceedings 57th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th. :1425-1430 Jun, 2007 |
| Relation: | 2007 57th Electronic Components and Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 1424409845 9781424409846 1424409853 9781424409853 |
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| تدمد: | 05695503 23775726 |
| DOI: | 10.1109/ECTC.2007.373982 |