Robust integration of an ULK SiOCH dielectric (k=2.3) for high performance 32nm node BEOL

التفاصيل البيبلوغرافية
العنوان: Robust integration of an ULK SiOCH dielectric (k=2.3) for high performance 32nm node BEOL
المؤلفون: Aimadeddine, M., Jousseaume, V., Arnal, V., Favennec, L., Farcy, A., Zenasni, A., Assous, M., Vilmay, M., Jullian, S., Maury, P., Delaye, V., Jourdan, N., Vanypre, T., Brun, P., Imbert, G., LeFriec, Y., Mellier, M., Chaabouni, H., Chapelon, L.L., Hamioud, K., Volpi, F., Louis, D., Passemard, G., Torres, J.
المصدر: 2007 IEEE International Interconnect Technology Conferencee International Interconnect Technology Conference, IEEE 2007. :175-177 Jun, 2007
Relation: 2007 IEEE International Interconnect Technology Conferencee
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:142441069X
9781424410699
1424410703
9781424410705
تدمد:2380632X
23806338
DOI:10.1109/IITC.2007.382382