مؤتمر
Robust integration of an ULK SiOCH dielectric (k=2.3) for high performance 32nm node BEOL
العنوان: | Robust integration of an ULK SiOCH dielectric (k=2.3) for high performance 32nm node BEOL |
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المؤلفون: | Aimadeddine, M., Jousseaume, V., Arnal, V., Favennec, L., Farcy, A., Zenasni, A., Assous, M., Vilmay, M., Jullian, S., Maury, P., Delaye, V., Jourdan, N., Vanypre, T., Brun, P., Imbert, G., LeFriec, Y., Mellier, M., Chaabouni, H., Chapelon, L.L., Hamioud, K., Volpi, F., Louis, D., Passemard, G., Torres, J. |
المصدر: | 2007 IEEE International Interconnect Technology Conferencee International Interconnect Technology Conference, IEEE 2007. :175-177 Jun, 2007 |
Relation: | 2007 IEEE International Interconnect Technology Conferencee |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 142441069X 9781424410699 1424410703 9781424410705 |
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تدمد: | 2380632X 23806338 |
DOI: | 10.1109/IITC.2007.382382 |