Demonstration of a Low Loss W-band Interconnect and Circuit Isolation Structure for Wafer Scale Assembly

التفاصيل البيبلوغرافية
العنوان: Demonstration of a Low Loss W-band Interconnect and Circuit Isolation Structure for Wafer Scale Assembly
المؤلفون: Farkas, David S., Luna, Tony, Chang-Chien, Patty P., Tornquist, Kelly, Fordham, Owen, Tsai, Roger
المصدر: 2007 IEEE/MTT-S International Microwave Symposium Microwave Symposium, 2007. IEEE/MTT-S International. :1641-1644 Jun, 2007
Relation: 2007 IEEE/MTT-S International Microwave Symposium
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:1424406870
9781424406876
1424406889
9781424406883
تدمد:0149645X
DOI:10.1109/MWSYM.2007.380002