مؤتمر
Dry Filmpackage for Systemin Packagemolding Process
| العنوان: | Dry Filmpackage for Systemin Packagemolding Process |
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| المؤلفون: | Sondag-Huethorst, J. A. M., de Jager, S., de Nooijer, C., van Silfhout, R. B. R., van Kleef, M. H. |
| المصدر: | TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International. :2071-2074 Jun, 2007 |
| Relation: | TRANSDUCERS 2007 - International Solid-State Sensors, Actuators and Microsystems Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 1424408415 9781424408412 1424408423 9781424408429 |
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| تدمد: | 2159547X 21641641 |
| DOI: | 10.1109/SENSOR.2007.4300572 |