Using Microgripper for Adhesive Bonding in Automatic Microassembly System

التفاصيل البيبلوغرافية
العنوان: Using Microgripper for Adhesive Bonding in Automatic Microassembly System
المؤلفون: Chang, R. J., Chen, C. C.
المصدر: 2007 International Conference on Mechatronics and Automation Mechatronics and Automation, 2007. ICMA 2007. International Conference on. :440-445 Aug, 2007
Relation: 2007 International Conference on Mechatronics and Automation
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781424408276
9781424408283
تدمد:21527431
2152744X
DOI:10.1109/ICMA.2007.4303583