مؤتمر
Substrate Design & Process Optimization of LGA (BT-based) Package
| العنوان: | Substrate Design & Process Optimization of LGA (BT-based) Package |
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| المؤلفون: | Chew, Carrie, Tan, Chip King |
| المصدر: | 2006 International Conference on Electronic Materials and Packaging Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on. :1-10 Dec, 2006 |
| Relation: | 2006 International Conference on Electronic Materials and Packaging |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424408337 9781424408344 |
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| DOI: | 10.1109/EMAP.2006.4430670 |