مؤتمر
A study of board level reliability test with bump structure of WLCSP lead-free solder joints
| العنوان: | A study of board level reliability test with bump structure of WLCSP lead-free solder joints |
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| المؤلفون: | Kao, Frank, Zhi Hao Tseng, Chun Sheng Ho, Stan Chen, Chang-Yi Lan, Feng Lung Chien |
| المصدر: | 2007 International Microsystems, Packaging, Assembly and Circuits Technology Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International. :323-326 Oct, 2007 |
| Relation: | 2007 International Microsystems, Packaging, Assembly and Circuits Technology |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424416363 9781424416370 |
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| تدمد: | 21505934 21505942 |
| DOI: | 10.1109/IMPACT.2007.4433627 |