دورية أكاديمية
150-$\mu{\rm m}$ Pitch Cu/Low-${\rm k}$ Flip Chip Packaging With Polymer Encapsulated Dicing Line (PEDL) and Cu Column Interconnects
| العنوان: | 150-$\mu{\rm m}$ Pitch Cu/Low-${\rm k}$ Flip Chip Packaging With Polymer Encapsulated Dicing Line (PEDL) and Cu Column Interconnects |
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| المؤلفون: | Yoon, S. W., Thew, S. M. L., Lim, S. Y. L., Hnin, W. Y., Chai, T. C., Viswanath, A. G. K., Kripesh, V. |
| المصدر: | IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 31(1):58-65 Feb, 2008 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 15213323 15579980 |
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| DOI: | 10.1109/TADVP.2008.916296 |