مؤتمر
Fabricating capacitive micromachined ultrasonic transducers with direct wafer-bonding and LOCOS technology
| العنوان: | Fabricating capacitive micromachined ultrasonic transducers with direct wafer-bonding and LOCOS technology |
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| المؤلفون: | Park, K.K., Lee, H.J., Kupnik, M., Oralkan, O., Khuri-Yakub, B.T. |
| المصدر: | 2008 IEEE 21st International Conference on Micro Electro Mechanical Systems Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on. :339-342 Jan, 2008 |
| Relation: | 2008 IEEE 21st International Conference on Micro Electro Mechanical Systems |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424417926 9781424417933 |
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| تدمد: | 10846999 |
| DOI: | 10.1109/MEMSYS.2008.4443662 |