مؤتمر
Comparison of the benefits, from SiO2 to ultralow-K dielectric and air spacing introduction, in term of interconnects performances, for the future high speed Ic’s in a multicoupled lines system
| العنوان: | Comparison of the benefits, from SiO2 to ultralow-K dielectric and air spacing introduction, in term of interconnects performances, for the future high speed Ic’s in a multicoupled lines system |
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| المؤلفون: | Ponchel, F., Legier, Jf., Paleczny, E., Seguinot, C., Deschacht, D. |
| المصدر: | 2007 IEEE Workshop on Signal Propagation on Interconnects Signal Propagation on Interconnects, 2007. SPI 2007. IEEE Workshop on. :25-28 May, 2007 |
| Relation: | 2007 IEEE Workshop on Signal Propagation on Interconnects |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424412235 9781424412242 |
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| DOI: | 10.1109/SPI.2007.4512199 |