مؤتمر
Thermo-mechanical simulations for 4-layer stacked IC packages
| العنوان: | Thermo-mechanical simulations for 4-layer stacked IC packages |
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| المؤلفون: | Ming-Che Hsieh, Chih-Kuang Yu |
| المصدر: | EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. :1-7 Apr, 2008 |
| Relation: | 2008 Intl. Conf. on Thermal, Mechanical & Multi-Physics simulation and Experiments in Microelectronics |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424421275 9781424421282 |
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| DOI: | 10.1109/ESIME.2008.4525007 |